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Design and Analysis Software Product List and Ranking from 7 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

Design and Analysis Software Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

  1. 日本シノプシス オプティカルソリューションビジネスユニット Tokyo//software
  2. システムクリエイト Osaka//Industrial Machinery
  3. デジタルデザインサービス 大阪本社 Osaka//CAD/CAM
  4. 4 AndTech Kanagawa//Service Industry
  5. 5 null/null
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Design and Analysis Software Product ranking

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
This ranking is based on the number of page views on our site.

  1. [Presentation of Materials] Reducing Workload for Glare Analysis that Optical Design Engineers Should Know 日本シノプシス オプティカルソリューションビジネスユニット
  2. Die casting design and analysis software 'CAST-DESIGNER' システムクリエイト
  3. White Paper Presentation!! "Analysis Guide for Mechanical Designers" デジタルデザインサービス 大阪本社
  4. 4 Control System Design Analysis Tools and Their Applications AndTech
  5. 5 Ansys Motor-CAD, analysis software for electric motor design

Design and Analysis Software Product List

1～13 item / All 13 items

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Die casting design and analysis software 'CAST-DESIGNER'

Die casting design and analysis software 'CAST-DESIGNER'

Rapid gate system design and CAE analysis with a single software.

"CAST-DESIGNER" is software equipped with both gate system design CAD functions and analysis functions. It enables the adjustment of appropriate gate systems and processing conditions in a short time. Additionally, it includes the analysis software "GEO-DESIGNER," which allows for rapid initial stage analysis, enabling design concepts that avoid defect risks at an earlier stage than gate design.

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  • simulator
  • Other analyses
  • Other CAD related software
  • Design and Analysis Software

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★Novelty Gift★ INTERMOLD 2016

★Novelty Gift★ INTERMOLD 2016

The password is! At the Autodesk booth, in the CAE Solutions corner, say "I saw the Ipros site."

INTERMOLD2016 27th Mold Processing Technology Exhibition ========================================= ■ Date: April 20 (Wednesday) - 23 (Saturday), 2016 ■ Venue: Intex Osaka ■ Booth Number: 6B-601 (within Autodesk booth) ■ Exhibited Products Resin Flow Analysis Software / Autodesk Moldflow Fluid Analysis Software / Autodesk CFD Structural Analysis Software / Autodesk Simulation Mechanical, Autodesk NASTRAN

  • Structural Analysis
  • Thermo-fluid analysis
  • Other analyses
  • Design and Analysis Software

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White Paper Presentation!! "Analysis Guide for Mechanical Designers"

White Paper Presentation!! "Analysis Guide for Mechanical Designers"

White Paper Presentation!! "Analysis Guide for Mechanical Designers"

White Paper Available Now!! This guide explains the key performance-related issues faced by mechanical designers and manufacturers, and introduces the benefits of using SOLIDWORKS analysis software throughout the product development cycle. SOLIDWORKS software can be applied to a wide range of issues in all fields of mechanical design, from automated machining to packaging machinery. With powerful analysis capabilities such as static analysis, motion analysis, thermal analysis, vibration analysis, fluid analysis, and nonlinear analysis, this software enables you to meet the design specifications of the products you are developing while ensuring reliability in the field. *For more details, please refer to the materials. Feel free to contact us with any inquiries. ▼The white paper can be downloaded from the link below▼

  • 3D CAD
  • Other CAD
  • Other CAD related software
  • Design and Analysis Software

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Comparison tool for the presence or absence of multi-quantum barriers in LEDs.

Comparison tool for the presence or absence of multi-quantum barriers in LEDs.

Tool for comparing the presence or absence of multi-quantum barriers in LEDs.

Explaining the tunneling model of multiple quantum barriers (MQB) and superlattices (SL). Simulation comparison with and without superlattices (band diagram, L-I characteristics, internal quantum efficiency (IQE), electron leakage, etc.). Multiple quantum barriers increase the potential barrier for electrons and block electron leakage more effectively.

  • simulator
  • Design and Analysis Software

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Application examples of the alloy design tool Thermo-Calc for solder alloys.

Application examples of the alloy design tool Thermo-Calc for solder alloys.

Introducing analysis examples for solder alloys! The alloy design tool Thermo-Calc can be used for material development and various manufacturing processes!

This is a collection of calculation examples for solder alloys using the alloy design tool Thermo-Calc. Thermo-Calc can optimize alloy processes, predict the effects of processes on microstructure, and forecast properties. 【Thermo-Calc】 - Phase diagram of Cu-Ni-Sn - Prediction of intermetallic compounds formed at the solder/substrate interface - Solidification calculations for Sn-Ag-Cu-In alloys (formation of solidification microstructure) - Prediction of liquidus/solidus temperatures - Liquid phase projection diagram of Sn-Ag-Cu - Surface tension of the liquid phase of CuSnBiIn - Viscosity of the liquid phase in SAC (Sn-Ag-Cu) + Bi 【Diffusion Module DICTRA】 - Cu-Sn diffusion pair

  • alloy
  • Non-ferrous metals
  • Other metal materials
  • Design and Analysis Software

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[Presentation of Materials] Reducing Workload for Glare Analysis that Optical Design Engineers Should Know

[Presentation of Materials] Reducing Workload for Glare Analysis that Optical Design Engineers Should Know

A dramatic reduction in development lead time through complete synchronization of optical design and stray light analysis!

This document explains the latest design workflow brought about by the direct integration of CODE V and LightTools, which are industry-standard design platforms. ■ Automatic model updates: Changes in imaging design are instantly reflected in the analysis model while retaining material property information. ■ Optimization of analysis efficiency: Utilizing sequential ray tracing achieves up to 27 times faster performance compared to traditional methods. ■ Improvement of design quality: Maximizes the number of trials and quickly identifies and addresses the sources of ghosting and flare. Engineers and project managers who want to efficiently and accurately tackle complex stray light issues should not miss this.

  • Optical Measuring Instruments
  • Design and Analysis Software

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Research tools for high-stress GaN devices

Research tools for high-stress GaN devices

Research tools for high-stress GaN devices

This explains the theoretical model of GaN multi-quantum wells (MQW) under high stress. It is possible to obtain the following results for GaN device LEDs grown on silicon in arbitrary crystal orientations using the CrossLight device simulator. The tensile stress from the silicon substrate reduces the band gap of the multi-quantum wells (MQW) and results in a longer wavelength. There is a decrease in piezoelectric charges within the multi-quantum wells (MQW). The reduction in internal quantum efficiency (IQE) is caused by the increase in piezoelectric charges at the electron blocking layer (EBL) interface.

  • simulator
  • Design and Analysis Software

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3D TCAD

3D TCAD

Approach to Practical 3D Simulation

Three-dimensional process and device simulation using Crosslight's TCAD. The functions and mechanisms are introduced through various devices (CMOS image sensors, LDMOS, FINFET, DMOS, LIGBT) including mesh generation, device structure creation, and analysis. Additionally, simulation using GPUs is also introduced.

  • simulator
  • Design and Analysis Software

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TCAD for power semiconductor devices

TCAD for power semiconductor devices

Analysis tool for power semiconductor devices using Crosslight Software's TCAD.

This introduces an overview of device simulations using LDMOS with a race track-shaped polysilicon gate and DMOS with a hexagonal polysilicon gate.

  • simulator
  • Design and Analysis Software

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Accelerating FDTD calculations with GPU

Accelerating FDTD calculations with GPU

Improvement of processing speed in FDTD calculations using GPUs

The 3D lens structure and CIS 3D CMOS image sensor are picked up as benchmark examples. The GPU version of Crosslight's FDTD shows a 66-fold improvement in processing for 3D real device structures. The benchmark results achieved processing speeds equivalent to a Core i7 3930K PC with 10 clusters (equivalent to 60 cores) using an inexpensive GPU card.

  • simulator
  • Design and Analysis Software

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Control System Design Analysis Tools and Their Applications

Control System Design Analysis Tools and Their Applications

★Learn control system design software from the basics! ★A software that can be easily used by those who are not very familiar with differential equations and complex number operations!

Lecturer Professor Ryoji Katayanagi, Department of Aerospace System Engineering, Kanazawa Institute of Technology Target Audience: Engineers, researchers, and relevant departments interested in control engineering Venue: Kawasaki City Educational and Cultural Center, Room 3 [Kanagawa, Kawasaki] 15 minutes on foot from JR and Keikyu "Kawasaki Station" Date and Time: May 20, 2011 (Thursday) 10:30 AM - 4:30 PM Capacity: 20 people *Registration will close once full. Please apply early. Participation Fee: 18,900 yen (including tax and textbook costs) for up to 2 people per company.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Design and Analysis Software

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